NAME OF COURSE/MODULE:  INTEGRATED CIRCUIT PACKAGING PROCESS
COURSE CODE: SFE 4053
NAME(S) OF ACADEMIC STAFF:   DR. AFFA ROZANA BT ABDUL RASHID
RATIONALE FOR THE INCLUSION OF THE COURSE/MODULE IN THE PROGRAMME: To enhance the basic knowledge and skills of students in integrated circuits packaging prior to joining the working world or to pursuing further studies.
SEMESTER AND YEAR OFFERED: SEM 2 / YEAR 3
TOTAL STUDENT LEARNING TIME (SLT) FACE TO FACE TOTAL GUIDED AND INDEPENDENT LEARNING
L = Lecture

T = Tutorial

P = Practical

O= Others

L

35

T

 

11

P

 

0

O

 

74

L + T + P + O = 120 HOURS

CREDIT VALUE: 3
PREREQUISITE (IF ANY): NONE
OBJECTIVES: The objectives of this course are to:

  1. To review the various technologies in IC Fabrication process and packaging assembly.
  2. To provide an overview of IC materials and processes, trends and available options which encompass electronic manufacturing.
LEARNING OUTCOMES:

 

At the end of this course students will be able to:
1.     Determine the types of process involved in fabrication of integrated circuit.2.     Understand the basic technologies in IC packaging, assembly and interconnections.

3.     Effectively explain scientific information in written and oral form.

4.     Select the appropriate packaging/assembly for specific application and requirements for the industry.

TRANSFERABLE SKILLS: Students should be able to develop an intuitive understanding of IC fabrication and assembly by focusing on the technologies, design, process and evaluation through a lectures and tutorials.
TEACHING-LEARNING AND ASSESSMENT STRATEGY: Teaching-learning strategy:

  • The course will be taught through a combination of formal lectures, assignments, group work, tutorials, informal activities and various textbooks.

Assessment strategy:

  • Formative
  • Summative
SYNOPSIS:

 

This course will teach students basic fundamentals of integrated circuit (IC) fabrications and packaging including MOS and bipolar technologies, Photolithography, Oxidation, permeation, ion implantation, growth epitaxial, thick and thin film components and the design and layout of equipment fabrication. It provides an overview of the materials and the processes, as well as the trends and available options, which encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to fabrication of the IC.
MODE OF DELIVERY: Lecture, Tutorial, Quizzes, Assignment and Group Work.
ASSESSMENT METHODS AND TYPES:
A. Continuous Assessment (60%)
Category Percentage
·    Quiz/Tutorial

·    Assignments  (include one assignment based on Aqli-Naqli Integration)

·    Mid-Term Test

·    Class Dialogue/Presentation/Debate/ Forum

15%

15%

15%

15%

B. Final Examination (40%)
Examination 40% ·    Structured and essay type questions
MAIN REFERENCES SUPPORTING THE COURSE 1.      Franssila, S. 2004. Introduction to Microfabrication. John Willey & Sons.

2.      May, G.S., Sze, S.M.2003. Fundamentals of Semiconductor Fabrication. John Wiley & Sons.

3.      Rao. R. Tummala (2001) Fundamentals of Microsystens Packaging, MrGraw-Hill.

ADDITIONAL REFERENCES SUPPORTING THE COURSE 1.       Richard C. Jaeger. (2002).Introduction to Microelectronic Fabrication, Modular Series On Solid State Devices, Prentice Hall.

2.       Modou. M. 2002. Fundamentals of Microfabrication. CRC Press.

3.       Stephen Campbell. (2008). Fabrication Engineering at the Micro – and Nanoscale. Third Edition, Oxford Press.

4.       Cohn, C., Harper, C. A. 2004. Failure-Free Integrated Circuit Packages). McGraw-Hill Professional.

5.       Franssila, S. 2004. Introduction to Microfabrication. John Willey & Sons.